活動專區

本次研討會將聚焦 AI 晶片架構革新的關鍵路徑，從 AI 驅動的 EDA 設計、Chiplet 與異質整合技術，到記憶體架構、先進封裝及 Edge AI 晶片發展，再延伸至 Physical AI 所帶動的新一代運算需求，協助產業掌握 AI 運算架構轉型下的技術趨勢與供應鏈新機遇，提前布局下一波 AI 晶片創新浪潮。

本論壇以「從算力到電力」為主軸，聚焦 AI 賦能、能源戰略與智造韌性三大面向，探討 AI 應用落地、數據治理、能源轉型與智慧製造等關鍵議題，協助企業掌握產業轉型趨勢，打造面向未來成長動能。

Hosted by TrendForce during SEMICON Taiwan week on September 3, 2026, at Humble House Taipei, this executive briefing explores key market dynamics across the AI ecosystem. Leading analysts will share insider insights on US and China hyperscaler datacenters, the 2026–2027 AI capex cycle, semiconductor processing equipment (SPE), and the MLCC market outlook, offering high-level executive networking and actionable supply chain intelligence.