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2025 中國SiC Power Device市場分析報告
發佈日期
2025-12-02
更新頻率
不定期
報告格式
This report analyzes the Chinese SiC power device market, driven by robust demand from EV high-voltage platforms and AI data centers. While intense price competition accelerates industry consolidation, it simultaneously propels the technological transition toward larger-sized wafers. Domestic manufacturers are enhancing competitiveness through vertical integration, while emerging applications in optics are creating new value opportunities for the supply chain.
Key Highlights
- EVs remain as the major driver of the market, while AI data centers and industrial applications are forming structural opportunities. China’s SiC power device market could potentially surpass US$6 billion by 2030.
- Mass production initiated for 8” SiC wafers as capacity expansions enter a new phase.
- Full series of SiC products (substrates/epitaxial wafers/devices) are hitting rock bottom in prices as industrial integration expedites.
- Optical and advanced packaging applications could inject new momentum for China’s SiC substrate market.
Table of Contents
- Overview
- Analysis of Chinese Market for SiC Substrates and Epitaxy
- Analysis of Chinese Market for SiC Devices
- Analysis on Dynamics of Major Chinese SiC Suppliers
- TrendForce’s View
<Total Pages: 61>
備註：本研究報告只有英文及簡中版本
報告分類: 化合物半導體
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