研究報告

2026年第三季鑽石等级NAND Flash數據

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發佈日期

2026-08-18

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更新頻率

每季

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報告格式

EXCEL


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提供有關NAND Flash產業每家公司晶圓的投入,產量,技術節點等完整的分析。

重點摘要

  • 市場趨勢與供需: 記憶體價格上漲導致個人電腦及智慧型手機需求放緩,但伺服器需求持續強勁,驅動產業位元產出成長。高層數製程與先進架構的比重大幅增加。
  • 主要供應商策略與規劃:
    • 三星 (Samsung):受限於廠區空間,加上策略性優先生產動態隨機存取記憶體(DRAM),三星主要依賴高層數製程轉進與產線升級來支援位元成長。
    • SK 海力士集團 (SK hynix Group):SK 海力士的主力廠區面臨空間限制,導致晶圓投片量小幅下修;其子公司 Solidigm 則積極擴充企業級儲存方案,並推動新廠產能上線。
    • 鎧俠 / 晟碟集團 (Kioxia / SanDisk Group):該集團在各大主要廠區擴大先進製程生產,同時推進下一代樣品開發,並未進行激進的實體廠房擴展。
    • 美光 (Micron):由於後段封裝與記憶體產線重新配置導致空間受限,美光依賴製程轉進與提高四層單元(QLC)採用率來提升位元產出。
    • 長江存儲 (YMTC):受惠於本土設備的技術進展,長江存儲正加速晶圓廠建設與產能擴充,位元產出成長幅度領先全行業。

目錄

  • Index
  • Worldwide Annual NAND Flash Capacity Forecasts
  • Global NAND Flash Production Breakdown by Makers
  • NAND Flash Makers' Production Breakdown by Node Technology
  • Samsung's Production Breakdown by Node Technology
  • Kioxia/SanDisk's Production Breakdown by Node Technology
  • SK hynix's Production Breakdown by Node Technology
  • Solidigm's Production Breakdown by Node Technology
  • Micron's Production Breakdown by Node Technology
  • YMTC's Production Breakdown by Node Technology
  • PSMC's Production Breakdown by Node Technology
  • Winbond's Production Breakdown by Node Technology
  • MXIC's Production Breakdown by Node Technology
  • SMIC's Production Breakdown by Node Technology
  • NAND Flash Makers' Production Breakdown by Architecture Type
  • Samsung's Production Breakdown by Architecture Type
  • Kioxia/SanDisk's Production Breakdown by Architecture Type
  • SK hynix's Production Breakdown by Architecture Type
  • Solidigm's Production Breakdown by Architecture Type
  • Micron's Production Breakdown by Architecture Type
  • YMTC's Production Breakdown by Architecture Type
  • PSMC's Production Breakdown by Architecture Type
  • Winbond's Production Breakdown by Architecture Type
  • MXIC's Production Breakdown by Architecture Type
  • SMIC's Production Breakdown by Architecture Type
  • Major NAND Flash Makers's Capacity Breakdown by Fab
  • Forecast of NAND Flash Makers' Output Breakdown by Type & Density
  • Forecast of Samsung's Capacity/ Output Breakdown by Fab
  • Forecast of Kioxia/SanDisk's Capacity/ Output Breakdown by Fab
  • Forecast of SK hynix's Capacity/ Output Breakdown by Fab
  • Forecast of Solidigm's Capacity/ Output Breakdown by Fab
  • Forecast of Micron's Capacity/ Output Breakdown by Fab
  • Forecast of YMTC's Capacity/ Output Breakdown by Fab
  • Forecast of NAND Flash Makers' Output Breakdown by Type & Density
  • Forecast of Samsung's NAND Flash Output Breakdown by Type & Density
  • Forecast of Kioxia/SanDisk's Output Breakdown by Type & Density
  • Forecast of SK hynix's Output Breakdown by Type & Density
  • Forecast of Solidigm's Output Breakdown by Type & Density
  • Forecast of Micron's Output Breakdown by Type & Density
  • Forecast of YMTC's Output Breakdown by Type & Density


<Total Pages: 40>





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